TSMC said it would include logic and mixed-signal options for all versions, with embedded memory available in each. In fact, demand is outstripping supply in the entire RF SOI supply chain, causing shortages on several fronts.”When we go to 5G, there will potentially be more bands depending upon the region, such as n77, n78 and/or 79, which will be deployed in different combinations across the globe. It’s not the whole thing.
“With growing demand, all three suppliers—Soitec, Shin-Etsu and GlobalWafers—keep increasing capacity,” he said. In 2014, TSMC announced that it has produced its first fully functional ARM-based networking processor with 16nm FinFET technology. Both are in short supply.Why future nodes will require new equipment and approaches.Among the big issues in this arena:Generally, though, RF switches and antenna tuners are based on RF SOI. The chips are processed using traditional etch, deposition, lithography and other steps.Soitec is the largest supplier of RF SOI substrates with 70% market share. Starting in (2019), all demand should be covered.”Manufacturing chips at future nodes is possible from a technology standpoint, but that’s not the only consideration.“Each new generation of handsets, for example, requires support for more and more bands and standards and each requires filters that are switched in and out of the circuit by RF SOI components. ‘TSMC’s industry leading manufacturing capability, coupled with Luxtera’s world-class silicon photonics design, together provide the highest performance and lowest cost optical transceivers available to our hyperscale, cloud, enterprise, and 5G mobile infrastructure customers.’
In short, more RF everything is needed to deliver the 5G promise of more data,” Thomas said.“There is a tight situation today, because demand is so strong. Several years ago, carriers deployed 2G and 3G wireless networks. SANTA CLARA, Calif. — TSMC reported progress in 7nm and extreme ultraviolet (EUV) lithography and bolstered a planar process that competes with fully depleted silicon-on-insulator at an annual event here. Announced last year, Luxtera and TSMC have jointly developed a unique silicon photonics platform in TSMC’s 300mm CMOS wafer foundry. It then moves to an antenna tuner, which allows the system to adjust to any frequency band.Switch chips and tuners, meanwhile, are based on RF SOI. Based on CMOS, the digital part consists of the applications processor and other devices.The RF components are integrated into a RF front-end module, which handles the transmit/receive functions. These processes range from 130nm to 45nm.Typically, the power amplifier is based on gallium arsenide (GaAs), which is a III-V compound. You cannot do 55nm on a 200mm line.”In operation, a signal reaches the main antenna.
For example, TSMC and others continue to evolve their 28nm bulk CMOS processes.